Demand for IC packaging leadframes is expected to fall further in Q4 2022, and it may take a quarter or two to see if demand will rebound, industry sources said, as inventory adjustments for consumer chips take longer than expected.
According to the Electronic Times, demand for packaged leadframes for custom high-end sensors, MEMS components and chips currently used in industrial control and automotive applications is relatively stable. However, demand related to mainstream logic computing chips and power management ICs (PMIC) remains weak.
Recently, China Taiwan packaging major Sunrise had said that it will be able to maintain sales growth in 2022, but capacity utilization will decline slightly in the fourth quarter of this year.
Sources had pointed out that the slowdown in consumer electronics demand is affecting not only second-tier back-end companies, but also leading companies such as Sun and Moon, and that utilization rates at Sun and Moon's main back-end plant in Kaohsiung will drop to between 70-80% in the fourth quarter of this year.
source：aijiweiAPP
Stay up to date with the latest in industry offers by subscribing us. Our newsletter is your key to receiving expert tips.
As the memory chip shortage is expected to persist through 2027, independent smartphone and laptop manufacturers are being forced to redesign products, screen incoming chips for counterfeit or substan
Yageo posted year-over-year and month-over-month revenue growth in August, extending its streak of record monthly highs to a sixth straight month. The passive components maker said strong AI-related d
Gartner's latest forecast shows that "global semiconductor revenue is expected to reach US$1.555 trillion in 2026, up 92% from US$809 billion in 2025, and is projected to increase further to US$1.
